关于会议

About ICM3-2022

会议主题

Conference Theme

会议组织

Organization

报告嘉宾

Invited speakers

会议直播

Livecast

会议注册及议程

Registration and Program

发起单位

Acknowledgment

参会指南

Meeting Guidelines

关于会议

About ICM3-2022

由中国材料研究学会计算材料学分会主办的“材料多尺度计算模拟国际会议”旨在为国内外科研工作者提供一个交流和展示多尺度计算模拟领域最新进展及成果的平台,促进材料多尺度计算模拟的发展,推动计算材料学领域内的学术进步以及相关行业的发展。经过多年的努力,材料多尺度计算模拟国际会议已经成为计算材料科学领域有影响力的国际会议之一。迄今为止,该会议已成功举办了13次。第14届材料多尺度计算模拟国际会议将于2022年7月4日-8日在成都举行,由电子科技大学承办,将围绕新型自旋电子材料及其输运特性、多体系统的量子理论与计算、高效能源转存材料与器件设计、拓扑电子态与拓扑磁性等方向的议题开展研讨。

组委会诚邀海内外相关领域的专家学者及企业界人士参会交流。相约成都,共创未来。


The International Conference of Multi-scale Modeling and Simulation of Materials (ICM3) is sponsored by the Computational Materials Science Branch of Chinese Materials Research Society (CMRS). The missions of ICM3 are to provide a platform for international researchers to communicate the latest progress in multi-scale computations and simulations, to promote the further development of multi-scale computational methods, and to connect the academic progress with the related industries. Since the first meeting on 2008, the ICM3 has been one of the most important academic conferences in the field of computational materials science with great efforts from each participant. The 14th ICM3 will be held at Chengdu, China from July 4th to 8th, 2022, hosted by the University of Electronic Science and Technology of China (UESTC). The topics include the new spintronic materials and their transport properties, quantum theory and simulation in many-body systems, non-adiabatic molecular dynamics, advanced materials and devices for energy conversation, topological states and topological magnetism, and some other hot topics related to novel electronic materials.

We are looking forward to the any contribution from domestic and international experts, scholars and entrepreneurs in the related research field. Welcome to ICM3, and welcome to Chengdu.

大会注册

Registration

大会注册

会议注册费:企业2400元/人,教师1200元/人,学生600元/人。

本次会议交通食宿自理,组委会可提供酒店协议价。

因疫情反复,注册费缴费暂未开放,具体缴费时间另行通知,请关注大会官方网站。

点此注册



墙报交流

大会欢迎各位同学进行墙报交流,并将设优秀奖若干名。如需提交墙报,请将文件发送至指定邮箱:yilansun@uestc.edu.cn 。

投稿要求:

a)墙报尺寸:90cm*120cm(竖版)

b)墙报格式:高清晰度pdf版

c)墙报页数:不超过一页

投稿截止时间:2022年06月27日。


会议主题

Conference Themes

  • no.1
    新型自旋电子材料及其输运特性
    New spintronic materials and their transport properties
  • no.2
    光、声、电多场耦合效应的多尺度模拟
    Multi-field simulations on the coupling effects of light, phonon and electricity
  • no.3
    多体系统的量子理论与计算
    Quantum theory and computation of many-body systems
  • no.4
    高效能源转存材料与器件设计
    Advanced materials and devices for energy conversation
  • no.5
    高性能结构材料
    High-performance structural materials
  • no.6
    拓扑电子态与拓扑磁性
    Topological states and topological magnetism
  • no.7
    机器学习及其在新材料预测与设计中的应用
    Machine learning and its applications in the prediction and design of new materials
会议组织

Organization

组织机构
Organization
主办单位:
Sponsor:
中国材料研究学会计算材料学分会
Computational Materials Science Branch of Chinese Materials Research Society
承办单位:
Organizer:
电子科技大学
University of Electronic Science and Technology of China
顾问委员会(按姓氏笔画排序)
Advisory Committee
王崇愚(清华大学/钢铁研究总院)
Chongyu Wang (Tsinghua University/Central Iron & Steel Research Institute)
王鼎盛(中国科学院物理研究所)
Dingsheng Wang (Institute of Physics,CAS)
叶恒强(中国科学院金属研究所)
Hengqiang Ye (Institute of Metal Research,CAS)
白以龙(中国科学院力学研究所)
Yilong Bai (Institute of Mechanics,CAS)
杨 锐(中国科学院金属研究所)
Rui Yang (Institute of Metal Research,CAS)
陈难先(清华大学)
Nanxian Chen (Tsinghua University)
南策文(清华大学)
Cewen Nan (Tsinghua University)
柳百新(清华大学)
Baixin Liu (Tsinghua University)
顾秉林(清华大学)
Binglin Gu (Tsinghua University)
高瑞平(国家自然科学基金委员会)
Ruiping Gao (National Natural Science Foundation of China)
崔俊芝(中国科学院数学与系统科学研究所)
Junzhi Cui (Academy of Mathematics and Systems Science,CAS)
黎乐民(北京大学)
Lemin Li (Peking University)
学术委员会(按姓氏笔画排序)
Academic Committee
于 涛(钢铁研究总院)
Tao Yu (Central Iron & Steel Research Institute)
马琰铭(吉林大学)
Yanming Ma (Jilin University)
申 江(北京科技大学)
Jiang Shen (University of Science and Technology Beijing)
吕广宏(北京航空航天大学)
Guanghong Lv (Beihang University)
孙 强(北京大学)
Qiang Sun (Peking University)
张文清(南方科技大学)
Wenqing Zhang (Southern University of Science and Technology)
赵纪军(大连理工大学)
Jijun Zhao (Dalian University of Technology)
段文晖(清华大学)
Wenhui Duan (Tsinghua University)
段纯刚(华东师范大学)
Chungang Duan (East China Normal University)
徐东生(中国科学院金属研究所)
Dongsheng Xu (Institute of Metal Research,CAS)
高世武(北京计算科学研究中心)
Shiwu Gao (Beijing Computational Science Research Center)
龚新高(复旦大学)
Xingao Gong (Fudan University)
曾 雉(中国科学院合肥物质研究院)
Zhi Zeng (Hefei Institutes of Physical Science,CAS)
魏苏淮(北京计算科学研究中心)
Suhuai Wei (Beijing Computational Science Research Center)
组织委员会(按姓氏笔画排序)
Organizing Committee
牛晓滨(电子科技大学)
Xiaobin Niu (University of Electronic Science and Technology of China)
付召明(云南师范大学)
Zhaoming Fu (Yunnan Normal University)
甘立勇(重庆大学)
Liyong Gan (Chongqing University)
何朝政(西安工业大学)
Chaozheng He (Xi'an Technological University)
杨明理(四川大学)
Mingli Yang (Sichuan University)
严 鹏(电子科技大学)
Peng Yan (University of Electronic Science and Technology of China)
张文旭(电子科技大学)
Wenxu Zhang (University of Electronic Science and Technology of China)
张妍宁(电子科技大学)
Yanning Zhang (University of Electronic Science and Technology of China)
周柳江(电子科技大学)
Liujiang Zhou (University of Electronic Science and Technology of China)
赵永红(四川师范大学)
Yonghong Zhao (Sichuan Normal University)
报告嘉宾

Invited speakers

会议安排

Conference overview


会议时间:2022年7月4-8号

Time: July 4-8 th, 2022


会议地点:祥宇宾馆(新南路店,成都市武侯区新南路103号)

Address:   Xiangyu Hotel (Xinnan Road Branch, No. 103 Xinnan Road, Wuhou District, Chengdu)


会议形式:线上线下结合

Meeting format:   online and on-site


会议直播:

Livecast


会议相关时间和形式
7月4日
4th of July
注册报到
Registration and check-in
祥宇宾馆大厅
the lobby of Xiangyu Hotel
7月5-6日
5th-6th of July
2022材料多尺度计算模拟国际会议
International Conference of Multi-scale Modeling and Simulation of Materials
祥宇宾馆报告厅
Conference Hall of Xiangyu Hotel
7月7-8日
7th-8th of July
培训课程(DPMD+DASP)
Training Course
祥宇宾馆报告厅
Conference Hall of Xiangyu Hotel

发起单位

Organizers

合作期刊

Collaborated Journals

JMI特刊已经上线,欢迎广大师生投稿,尤其是机器学习在电子材料的应用方面。
赞助单位

Sponsor